Redmi Turbo 4 to feature MediaTek Dimensity 8400-Ultra SoC as Realme teases Neo 7 SE
Redmi has announced that its upcoming Turbo 4 smartphone will feature the MediaTek Dimensity 8400-Ultra chipset, making it the first device to use this processor. The launch is scheduled for early 2025 in China. Realme has also teased a new smartphone powered by the MediaTek Dimensity 8400 SoC. A tipster suggests this device may be the Realme Neo 7 SE, which is expected to follow the recently launched Realme Neo 7. The Dimensity 8400 chipset offers advanced features, including support for high-resolution cameras and displays. It includes eight cores and is designed for enhanced performance in AI tasks and photography.