Researchers develop E-LIG for flexible, double-sided PCBs

Researchers at MIT Media Lab have developed a new method called E-LIG for creating flexible, double-sided printed circuit boards (PCBs). This innovative approach uses lasers to create circuits that can integrate a variety of devices, such as sensors and actuators. E-LIG combines laser-induced graphene (LIG) patterning with copper electroplating. This technology allows for the precise design of high-resolution circuits on flexible and transparent materials. It can create circuits as small as 50 micrometers. The new method is particularly beneficial for the growing fields of wearables, soft robotics, and interactive surfaces. Unlike traditional PCB manufacturing, which can be complex and limited to specific materials, E-LIG simplifies the process. It can produce large-area electronics up to 100 square centimeters with ease. Additionally, E-LIG supports the integration of functional devices directly with control circuits on the same substrate. This capability opens the door to applications, such as real-time graphics and interactive technology. E-LIG also allows for easy repairs of damaged circuits, making it both durable and cost-effective for various electronic applications.