TSMC boosts global EUV share to 56% with record expansion in advanced chipmaking

Taiwan Semiconductor Manufacturing Co (TSMC) has expanded its use of extreme ultraviolet (EUV) lithography systems, increasing its global share from 50% in 2020 to 56% in 2023. This growth comes despite the high costs of EUV machines, which exceed $100 million each. The company has significantly boosted its EUV capacity, acquiring over 100 systems in 2023 alone. TSMC's reliance on EUV technology has grown since it first used it for 7nm+ processes in 2019, now supporting 5nm and 3nm nodes. Despite this expansion, TSMC is cautious about adopting next-generation high-numerical aperture EUV systems, focusing on evaluating their costs and benefits. The company faces challenges from U.S. export restrictions on advanced chips to China, impacting its stock performance.